AI optical interconnect companies
Top AI Optical Interconnect Companies to KnowA neutral guide to optical interconnect companies that help move data through AI data centers.
Insights
AI Infrastructure Research Articles
Evergreen pages for the AI data center infrastructure stack, plus weekly engine-synthesised industry insights from the V20.21 product-axis pipeline.
Industry insights — engine-synthesised
8 insights · refreshed hourly
Cross-topic product synthesis from the V20.21 engine. Each insight names companies + opportunity and links back to the underlying signals via row-level provenance.
Jun 10, 2026 · industryhot
Enterprise LLM Agent Platform (Cursor / Devin / Claude Enterprise / Cortex) — closed-source LLM API + agent platform + enterprise controls
Enterprise LLM Agent Platform (Cursor / Devin / Claude Enterprise / Cortex) — closed source LLM API + agent platform + enterprise controls Companies committing: openai, anthropic,
Jun 10, 2026 · industryhot
Onsite Datacenter Power: Fuel Cell + Microgrid + Gas Turbine — behind-the-meter generation & MV switchgear
Onsite Datacenter Power: Fuel Cell + Microgrid + Gas Turbine — behind the meter generation & MV switchgear Companies committing: bloom energy, generac, schneider electric, vertiv,
Jun 10, 2026 · industrysteady
Active Electrical Cable (AEC) & Smart Cable Module (800G OSFP) — in-cable retimer module
Active Electrical Cable (AEC) & Smart Cable Module (800G OSFP) — in cable retimer module Companies committing: astera labs, credo technology. Opportunity: AECs replace optics ins
Jun 10, 2026 · industryrising
PCIe Gen6 / CXL / UALink Retimer & Rack-Scale Connectivity ASIC — connectivity ASIC (retimer, switch, smart NIC)
PCIe Gen6 / CXL / UALink Retimer & Rack Scale Connectivity ASIC — connectivity ASIC (retimer, switch, smart NIC) Companies committing: astera labs, enfabrica. Opportunity: GB200/
Jun 10, 2026 · industryrising
HBM 2.5D / 3D Advanced Packaging (TSV, Interposer, KGSD) — OSAT package + memory stack
HBM 2.5D / 3D Advanced Packaging (TSV, Interposer, KGSD) — OSAT package + memory stack Companies committing: tsmc, amkor technology, amd, cerebras systems, ase technology, astera
Jun 10, 2026 · industryrising
Direct-to-Chip Liquid Cooling & CDU (100kW+/rack) — cold plate / CDU / rear-door HX
Direct to Chip Liquid Cooling & CDU (100kW+/rack) — cold plate / CDU / rear door HX Companies committing: nvent electric, digital realty, compass datacenters, modine manufacturing
Jun 10, 2026 · industryhot
AI-Optimized Ethernet Switching Fabric (RoCEv2, lossless) — data-center switch / NIC / fabric IP
AI Optimized Ethernet Switching Fabric (RoCEv2, lossless) — data center switch / NIC / fabric IP Companies committing: meta platforms, arista networks, cisco systems, juniper netw
Jun 10, 2026 · industryhot
800G/1.6T Silicon Photonics & Co-Packaged Optics (CPO) — optical transceiver / CPO module
800G/1.6T Silicon Photonics & Co Packaged Optics (CPO) — optical transceiver / CPO module Companies committing: astera labs, ayar labs, celestica, semtech, credo technology, lumen
Evergreen research
Hand-curated research articles maintained for SEO authority on each major stack layer.
CPO companies
Top CPO and Silicon Photonics Companies for AI Data CentersA practical map of companies and technologies tied to co-packaged optics, silicon photonics, and future AI data center interconnect.
AI networking companies
Top AI Networking Companies Building the Data Center FabricA neutral guide to AI networking companies across Ethernet, switching silicon, custom ASICs, retimers, and connectivity chips.
AI data center power companies
Top AI Data Center Power Infrastructure CompaniesA neutral guide to companies involved in data center power systems, distribution, grid-facing infrastructure, and electrical deployment.
AI data center cooling companies
Top AI Data Center Cooling CompaniesA neutral guide to thermal management and liquid cooling companies relevant to high-density AI data centers.
Broadcom vs Marvell AI
Broadcom vs Marvell: AI Infrastructure Exposure ExplainedA neutral explanation of how Broadcom and Marvell differ across AI networking, custom silicon, optical DSPs, and data infrastructure.
Lumentum vs Coherent
Lumentum vs Coherent: Optical Infrastructure Exposure ExplainedA neutral comparison of Lumentum and Coherent through optical components, lasers, photonics, and data center infrastructure roles.
CPO vs pluggable optics
CPO vs Pluggable Optics: What Matters for AI Data CentersA plain-English comparison of co-packaged optics and pluggable optics for AI data center networking.
800G vs 1.6T optical transceivers
800G vs 1.6T Optical Transceivers: Why Bandwidth MattersA plain-English explainer on 800G and 1.6T optical transceivers and why higher bandwidth matters for AI data centers.
AI data center supply chain map
AI Data Center Supply Chain Map: From GPUs to Power and CoolingA full-stack map of the AI data center supply chain across accelerators, networking, optics, power, cooling, manufacturing, testing, and deployment.