Layer L4
Chips
The silicon: compute devices plus the equipment, foundry, and design stack behind them.
GPUs, custom ASICs, semicap, foundry, EDA & IP, power semiconductors
Topics in this layer
AI ASICs
Hyperscaler silicon: TPU, Trainium, MTIA, Maia — and the merchant gap they create.
AI Accelerator Startups
The merchant challengers to NVIDIA: Groq LPU, Cerebras wafer-scale, Etched transformer-ASIC, and the rest.
EDA & Chip-Design IP
The design-stack chokepoint behind every AI chip: Cadence, Synopsys, Siemens EDA, and Arm IP.
Semiconductor Equipment (WFE)
ASML, AMAT, Lam, KLA, TEL: the wafer-fab equipment behind every AI chip.
Power Semiconductors (SiC & GaN)
The SiC/GaN devices behind 800V datacenter distribution and high-density GPU power.
Foundry Capacity
Who gets the wafers — TSMC, Samsung, Intel Foundry — now decides who ships AI chips.
Companies (39)
Ranked leaderboard →Ranked suppliers for Chips
Companies grouped by what they build, with the latest verified signal per company.
View the L4 leaderboard →Engineering reference, not investment advice.