HBM-integrated 2.5D Advanced Packaging (TSV + chiplet) — advanced package

HBM-integrated 2.5D Advanced Packaging (TSV + chiplet) — advanced package

Companies committing: tsmc, amkor-technology, amd, cerebras-systems, astera-labs.

Opportunity: HBM/2.5D capacity is the rate-limiter on every AI accelerator launch in 2026; TSMC + Amkor are the bottleneck nodes, AMD and Cerebras are the demand side, Astera is bolting on chiplets for connectivity.

Demand side (AMD MI / Cerebras WSE) and supply side (TSMC TSV / Amkor qual) are both hiring at staff/principal level — a clean two-sided market signal. CoWoS/TSV is no longer 'experimental' on JDs, it's an HVM line.