HBM Memory — Timeline
60 milestones, source-traced.
May 13, 2025
Leadership Change: Amkor announced the appointment of Megan Faust as Executive Vice President and CFO effective…
Amkor announced the appointment of Megan Faust as Executive Vice President and CFO effective in 2025, succeeding Giel Rutten-era finance leadership as the company scales advanced-packaging capex above $850 million.
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May 15, 2025
Leadership Change: At its 2025 annual shareholders meeting, ASE Technology Holding reaffirmed its leadership team under…
At its 2025 annual shareholders meeting, ASE Technology Holding reaffirmed its leadership team under Chairman Jason Chang and CEO Tien Wu and approved a cash dividend of NT$3.0 per share, while reiterating that AI-driven advanced packaging would be the primary growth engine through 2026.
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Jun 4, 2025
Product Launch: ASE detailed expansions to its VIPack advanced packaging platform — including FOCoS-Bridge and FOCoS-CL…
ASE detailed expansions to its VIPack advanced packaging platform — including FOCoS-Bridge and FOCoS-CL — designed to support reticle-size-plus interposers and co-packaging of 8 to 12 HBM3E/HBM4 stacks with large logic die for AI accelerators.
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Jun 10, 2025
Product Launch: Micron announced shipment of HBM4 36GB 12-high samples to key customers, delivering over 2.0…
Micron announced shipment of HBM4 36GB 12-high samples to key customers, delivering over 2.0 TB/s of bandwidth per stack — more than 60% greater than HBM3E — for next-generation AI platforms.
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Jun 12, 2025
Capacity Expansion: Micron announced a $2 billion expansion of its Manassas, Virginia fab to support long-lifecycle…
Micron announced a $2 billion expansion of its Manassas, Virginia fab to support long-lifecycle memory production, complementing its broader $200B U.S. memory manufacturing roadmap that underpins HBM packaging in Idaho and New York.
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Jun 25, 2025
Earnings: Micron reported FQ3 2025 revenue of $9.3 billion with non-GAAP EPS of $1.91, with…
Micron reported FQ3 2025 revenue of $9.3 billion with non-GAAP EPS of $1.91, with HBM revenue growing nearly 50% sequentially and the company saying its HBM3E was sold out for calendar 2025.
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Jun 25, 2025
Leadership Change: Micron announced the appointment of Mark Murphy as Executive Vice President and Chief Financial…
Micron announced the appointment of Mark Murphy as Executive Vice President and Chief Financial Officer effective late 2025, succeeding Mark Liu who served as interim CFO after Manish Bhatia's departure, as the company scales HBM operations toward a multi-billion-dollar quarterly business.
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Jul 1, 2025
Funding: TSMC announced an additional $100 billion investment in its Arizona manufacturing expansion.
funding-research →Jul 17, 2025
Capacity Expansion: On its Q2 2025 earnings call, TSMC reiterated plans to roughly double CoWoS advanced-packaging…
On its Q2 2025 earnings call, TSMC reiterated plans to roughly double CoWoS advanced-packaging capacity to about 75,000 wafers per month by end-2025 to meet HBM/AI accelerator demand, and raised 2025 capex guidance to a range of $38-42 billion.
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Jul 22, 2025
Capacity Expansion: Amkor reaffirmed plans for its ~$2 billion Peoria, Arizona advanced packaging and test campus,…
Amkor reaffirmed plans for its ~$2 billion Peoria, Arizona advanced packaging and test campus, supported by up to $407 million in CHIPS Act direct funding, with first production targeted for 2027 to serve HPC/AI customers.
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Jul 24, 2025
Earnings: SK Hynix reported record Q2 2025 revenue of 22.23 trillion won and operating profit…
SK Hynix reported record Q2 2025 revenue of 22.23 trillion won and operating profit of 9.21 trillion won (41% margin), driven by surging HBM3E sales to AI accelerator customers.
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Jul 28, 2025
Earnings: Amkor reported Q2 2025 net sales of approximately $1.50 billion with diluted EPS of…
Amkor reported Q2 2025 net sales of approximately $1.50 billion with diluted EPS of $0.17, citing stronger communications and computing demand tied to advanced packaging for AI.
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Jul 31, 2025
Earnings: Samsung Electronics reported Q2 2025 revenue of 74.6 trillion won with operating profit of…
Samsung Electronics reported Q2 2025 revenue of 74.6 trillion won with operating profit of 4.68 trillion won, a roughly 55% YoY decline, citing one-off inventory charges tied to advanced-node DRAM and delays in qualifying HBM3E 12-high for NVIDIA.
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Jul 31, 2025
Earnings: ASE Technology reported Q2 2025 consolidated revenue of NT$152.9 billion (about US$4.7B), up roughly…
ASE Technology reported Q2 2025 consolidated revenue of NT$152.9 billion (about US$4.7B), up roughly 8% year-over-year, with ATM (assembly, test and materials) revenue of NT$88.6 billion led by advanced packaging demand tied to AI accelerators.
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Aug 21, 2025
Capacity Expansion: SK Hynix held the M15X fab completion ceremony in Cheongju on August 21, 2025,…
SK Hynix held the M15X fab completion ceremony in Cheongju on August 21, 2025, marking a 20 trillion won investment dedicated primarily to HBM production, with operations starting in November 2025.
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Sep 4, 2025
Customer Win: Samsung confirmed its HBM3E 12-high (36GB) stacks passed NVIDIA qualification, clearing a long-delayed approval…
Samsung confirmed its HBM3E 12-high (36GB) stacks passed NVIDIA qualification, clearing a long-delayed approval that opens supply into NVIDIA's Blackwell-class GPU platforms starting Q4 2025.
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Sep 4, 2025
Partnership: Amkor and TSMC expanded their previously announced collaboration to bring advanced packaging (including CoWoS-class…
Amkor and TSMC expanded their previously announced collaboration to bring advanced packaging (including CoWoS-class flows) to Arizona, linking TSMC's Phoenix fabs with Amkor's Peoria packaging site to localize AI accelerator supply chains.
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Sep 9, 2025
Partnership: TSMC confirmed at its 2025 OIP/tech symposium cycle that NVIDIA's Rubin (R100) AI GPU…
TSMC confirmed at its 2025 OIP/tech symposium cycle that NVIDIA's Rubin (R100) AI GPU will be built on TSMC N3P with CoWoS-L packaging and 8-site HBM4 stacks, with risk production targeted for late 2025 and volume ramp in 2026.
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Sep 10, 2025
Capacity Expansion: ASE confirmed accelerated build-out of its Kaohsiung K28 advanced packaging facility with roughly US$1.6…
ASE confirmed accelerated build-out of its Kaohsiung K28 advanced packaging facility with roughly US$1.6 billion of incremental 2025 capex earmarked for FOCoS-Bridge and 2.5D/3D lines that integrate logic die with HBM stacks for AI customers.
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Sep 18, 2025
Partnership: Amkor Technology partnered with Tesoro VC, TSMC, and Cadence Design Systems to launch an…
Amkor Technology partnered with Tesoro VC, TSMC, and Cadence Design Systems to launch an AI and Semiconductor Hub in Phoenix, Arizona.
funding-research →Sep 23, 2025
Earnings: Micron reported record FQ4 2025 revenue of $11.3 billion, with data center revenue more…
Micron reported record FQ4 2025 revenue of $11.3 billion, with data center revenue more than doubling year-over-year and HBM annualized revenue run rate exceeding $8 billion.
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Sep 23, 2025
Customer Win: Micron confirmed its HBM3E 12-high 36GB is qualified and shipping in volume to NVIDIA…
Micron confirmed its HBM3E 12-high 36GB is qualified and shipping in volume to NVIDIA for the Blackwell Ultra (GB300) platform, with the company citing HBM market share approaching its overall DRAM share of ~20-25% by end of CY2025.
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Sep 26, 2025
Product Launch: SK Hynix announced completion of the world's first HBM4 development on September 26, 2025,…
SK Hynix announced completion of the world's first HBM4 development on September 26, 2025, with 12-high 36GB stacks delivering over 2TB/s bandwidth, and stated mass production readiness for shipments to Nvidia's Rubin platform.
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Sep 30, 2025
Customer Win: Micron Technology qualified HBM3E for NVIDIA H200 platform (sold-out through 2025-2026); now second-largest HBM…
Micron Technology qualified HBM3E for NVIDIA H200 platform (sold-out through 2025-2026); now second-largest HBM supplier into NVIDIA after SK Hynix.
customer_wins_seed →Oct 1, 2025
Partnership: Samsung Electronics signed a letter of intent with OpenAI to supply HBM and advanced…
Samsung Electronics signed a letter of intent with OpenAI to supply HBM and advanced DRAM for the Stargate AI infrastructure buildout, part of a combined Korean memory commitment of up to 900,000 wafers per month with SK Hynix.
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Oct 16, 2025
Earnings: TSMC reported Q3 2025 revenue of NT$989.9B (~$33.1B) and net income of ~$14.8B with…
TSMC reported Q3 2025 revenue of NT$989.9B (~$33.1B) and net income of ~$14.8B with gross margin of 59.5%, driven by AI accelerator and HBM-base-die demand; HPC contributed roughly 57% of wafer revenue.
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Oct 27, 2025
Earnings: Amkor posted Q3 2025 revenue near $1.70 billion, with management highlighting double-digit year-over-year growth…
Amkor posted Q3 2025 revenue near $1.70 billion, with management highlighting double-digit year-over-year growth in advanced packaging driven by AI/HPC and HBM-related test demand.
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Oct 27, 2025
Customer Win: On its Q3 2025 call, Amkor disclosed expanded 2.5D advanced packaging engagements with multiple…
On its Q3 2025 call, Amkor disclosed expanded 2.5D advanced packaging engagements with multiple HPC/AI customers and reiterated full-year 2025 capex of roughly $850 million focused on AI-related packaging and test capacity.
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Oct 29, 2025
Earnings: SK Hynix posted record Q3 2025 revenue of 24.4 trillion won and operating profit…
SK Hynix posted record Q3 2025 revenue of 24.4 trillion won and operating profit of 11.4 trillion won, with HBM accounting for over 40% of DRAM revenue as HBM3E 12-high shipments ramped.
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Oct 30, 2025
Earnings: Samsung's Q3 2025 earnings showed record revenue of 86.1 trillion won and operating profit…
Samsung's Q3 2025 earnings showed record revenue of 86.1 trillion won and operating profit of 12.2 trillion won, with management citing the start of HBM3E 12-high volume shipments and a memory operating profit of roughly 7 trillion won.
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Oct 30, 2025
Earnings: ASE posted Q3 2025 consolidated revenue of about NT$165.8 billion and guided that advanced…
ASE posted Q3 2025 consolidated revenue of about NT$165.8 billion and guided that advanced packaging and testing for AI (including FOCoS-Bridge and CoWoS-related back-end flows) would account for roughly 10% of ATM revenue in 2026, more than double 2024 levels.
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Nov 12, 2025
Capacity Expansion: Samsung disclosed an acceleration of its Pyeongtaek P4 Phase 2 fab buildout dedicated to…
Samsung disclosed an acceleration of its Pyeongtaek P4 Phase 2 fab buildout dedicated to HBM4 and 1c-node DRAM, with roughly 20 trillion won of capex earmarked and initial HBM4 production targeted for 2026.
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Jan 15, 2026
Earnings: TSMC's Q4 2025 results showed revenue of NT$868.5B with 59.0% gross margin and full-year…
TSMC's Q4 2025 results showed revenue of NT$868.5B with 59.0% gross margin and full-year 2025 revenue up ~34% YoY; management said AI accelerator revenue more than tripled in 2025 and guided CoWoS capacity to again roughly double in 2026 to support HBM3E/HBM4 ramps.
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Jan 25, 2026
Customer Win: SK Hynix is AMD's primary HBM3/HBM3E supplier for the MI300 series GPU accelerators powering…
SK Hynix is AMD's primary HBM3/HBM3E supplier for the MI300 series GPU accelerators powering hyperscaler GPU clusters.
customer_wins_seed →Feb 5, 2026
Company Fact: ASE's credit rating was affirmed at BBB (Long-Term Issuer Default Rating) and F3 (Short-Term)…
ASE's credit rating was affirmed at BBB (Long-Term Issuer Default Rating) and F3 (Short-Term) by Fitch.
funding-research →Mar 1, 2026
Customer Win: SK Hynix is NVIDIA's lead HBM3 / HBM3E supplier, having shipped first-to-market HBM3E to…
SK Hynix is NVIDIA's lead HBM3 / HBM3E supplier, having shipped first-to-market HBM3E to qualify into H200 in early 2025 and continued primary-supplier role through HBM4 ramp.
customer_wins_seed →Mar 19, 2026
Product Launch: Samsung announced sample shipments of its HBM4 12-high 36GB product with per-stack bandwidth exceeding…
Samsung announced sample shipments of its HBM4 12-high 36GB product with per-stack bandwidth exceeding 2 TB/s and a 4nm logic base die from Samsung Foundry, positioning for qualification with NVIDIA and AMD ahead of 2H 2026 volume.
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Mar 20, 2026
Customer Win: TSMC is NVIDIA's sole supplier of CoWoS-L 2.5D advanced packaging (HBM interposer + base…
TSMC is NVIDIA's sole supplier of CoWoS-L 2.5D advanced packaging (HBM interposer + base die), with capacity sold out through 2026 driving capex doubling in 2025-2026.
customer_wins_seed →Apr 1, 2026
News Mention: Micron Technology (MU) filed SEC Form 8-K on 2026-04-01 (period 2026-03-31); items 8.01,9.01.
sec_edgar →Apr 10, 2026
Customer Win: Samsung Electronics achieved HBM3E qualification for NVIDIA (Q4 2025) after multi-quarter delay, beginning volume…
Samsung Electronics achieved HBM3E qualification for NVIDIA (Q4 2025) after multi-quarter delay, beginning volume shipments into NVIDIA platforms.
customer_wins_seed →May 1, 2026
Partnership: Samsung partnered with Tenstorrent to unveil the Galaxy AI Platform targeting scale and efficiency.
funding-research →May 19, 2026
Acquisition: Samsung's portfolio company Empower Semiconductor was acquired by Analog Devices for $1.5 billion.
funding-research →May 19, 2026
Acquisition: Analog Devices acquired Empower Semiconductor, a company in Samsung's investment portfolio, for $1.5 billion.
funding-research →May 27, 2026
Company Fact: SK Hynix's market capitalization reached $1 trillion after shares surged over 11% in a…
SK Hynix's market capitalization reached $1 trillion after shares surged over 11% in a single day, driven by HBM demand for AI servers.
funding-research →May 28, 2026
Funding: Samsung participated in Anthropic's $65 billion Series H round at a $965 billion post-money…
Samsung participated in Anthropic's $65 billion Series H round at a $965 billion post-money valuation.
funding-research →May 28, 2026
Partnership: Samsung participated as an investor in Anthropic's $65 billion Series H funding round, which…
Samsung participated as an investor in Anthropic's $65 billion Series H funding round, which valued Anthropic at $965 billion post-money.
funding-research →Jun 1, 2026
Funding: ASE increased its 2026 annual capital expenditure to a record US$7 billion to meet…
ASE increased its 2026 annual capital expenditure to a record US$7 billion to meet AI application demand, up 27% from 2025's US$5.5 billion.
funding-research →Jun 1, 2026
Partnership: SK Hynix announced a new US-based AI solutions company with a $10 billion commitment,…
SK Hynix announced a new US-based AI solutions company with a $10 billion commitment, led by Yotta Capital Partners and NGP Capital with strategic investments from NVIDIA and BNP Paribas.
funding-research →Jun 1, 2026
Partnership: Alphabet's Google was approved to invest NT$27.08 billion (US$859.98 million) in Taiwan, with plans…
Alphabet's Google was approved to invest NT$27.08 billion (US$859.98 million) in Taiwan, with plans to infuse NT$25.34 billion into Charter Investments Ltd via its Singapore subsidiary.
funding-research →Jun 1, 2026
Product Launch: ASE guided 2026 LEAP (Lead-in-Early-Advanced-Packaging) revenue to exceed US$3.5 billion, up 10% from prior…
ASE guided 2026 LEAP (Lead-in-Early-Advanced-Packaging) revenue to exceed US$3.5 billion, up 10% from prior outlook, driven by AI chip demand.
funding-research →Jun 9, 2026
Leadership Change: Micron Technology, Inc. appointed Alexis Black Björlin as a new independent member of its…
Micron Technology, Inc. appointed Alexis Black Björlin as a new independent member of its Board of Directors, effective June 9, 2026.
sec_edgar →Jun 9, 2026
Funding: Samsung invested $175 million in Element Biosciences' Series E round, becoming its top shareholder.
funding-research →Jun 9, 2026
News Mention: Micron Technology (MU) filed SEC Form 8-K on 2026-06-09 (period 2026-06-09); items 5.02,9.01.
sec_edgar →Jun 9, 2026
Partnership: Samsung became the top shareholder in Element Biosciences by leading its $175 million Series…
Samsung became the top shareholder in Element Biosciences by leading its $175 million Series E funding round, with regulatory approval pending.
funding-research →Jun 17, 2026
Funding: Samsung participated in Zadar Labs' $17 million Series A round for Imaging Radars.
funding-research →Jun 17, 2026
Partnership: Samsung participated in Zadar Labs' $17 million Series A funding round for Imaging Radars…
Samsung participated in Zadar Labs' $17 million Series A funding round for Imaging Radars for Physical AI.
funding-research →Jun 24, 2026
Ipo Event: SK Hynix filed regulatory paperwork for a $29.4 billion (45.45 trillion won) US listing,…
SK Hynix filed regulatory paperwork for a $29.4 billion (45.45 trillion won) US listing, with trading expected to start July 10, 2026.
funding-research →Jun 24, 2026
News Mention: Micron Technology (MU) filed SEC Form 8-K on 2026-06-24 (period 2026-06-24); items 2.02,9.01.
sec_edgar →Jun 25, 2026
Earnings: Micron Technology (MU) filed SEC Form 10-Q on 2026-06-25 (period 2026-05-28).
sec_edgar →Jul 10, 2026projected
Ipo Event: SK Hynix plans to raise $29.4 billion (45.45 trillion won) via a Nasdaq IPO,…
SK Hynix plans to raise $29.4 billion (45.45 trillion won) via a Nasdaq IPO, with trading expected to begin on July 10, 2026.
funding-research →
Milestones merged from 0 curated events, 0 verified facts (with observed dates), and 60 business signals from the last 24 months. Deduped by date + label; curated entries take precedence.
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