Companies in Advanced Packaging (CoWoS & SoIC)
10 active companies tracked.
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Absolics
Supplier of glass substrates for advanced packaging that boost routing density and reliability of leading-edge AI chips.
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Amkor Technology
US-based OSAT. Arizona advanced-packaging facility under CHIPS Act funding; positioned for US-sourced HBM + chiplet packaging — geopolitical hedge against TSMC concentration.
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ASE Group
Leading pure-play OSAT with critical 2.5D/3D packaging capabilities for AI accelerators, GPUs, and FPGAs.
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ASE Technology
Worlds largest OSAT (outsourced semiconductor assembly + test). FOCoS-Bridge packaging is the merchant alternative to TSMC CoWoS — capacity ramp watched for cost-of-AI relief.
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Deca Technologies
Technology specialist in fan-out wafer-level packaging (FOWLP) building US-based open innovation platforms for AI and HPC.
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JCET
Top global OSAT specializing in advanced packaging for high-performance modules and AI chips.
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Samsung Electronics
HBM second-source (~30% share). NVIDIA qualification delays on HBM3E remain a tracked watch-point. AMD MI300 / Intel Gaudi confirmed customer mix.
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SK Hynix
HBM market leader (~50% share). HBM3E volume production lead; HBM4 sample shipments. Primary supplier into NVIDIA H100/H200/B200 + B100 platforms.
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SPIL (Siliconware Precision)
Established OSAT that opened a new AI-focused advanced packaging plant in Taichung in 2025.
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TSMC
CoWoS advanced packaging — the constrained step for AI accelerator + HBM integration. CoWoS-S / -L / -R / SoIC capacity expansion is the most-tracked supply-side number in 2026 AI infrastructure.