Companies in Advanced Packaging (CoWoS & SoIC)
5 active companies tracked.
L3
Amkor Technology
US-based OSAT. Arizona advanced-packaging facility under CHIPS Act funding; positioned for US-sourced HBM + chiplet packaging — geopolitical hedge against TSMC concentration.
L3
ASE Technology
Worlds largest OSAT (outsourced semiconductor assembly + test). FOCoS-Bridge packaging is the merchant alternative to TSMC CoWoS — capacity ramp watched for cost-of-AI relief.
L3
Samsung Electronics
HBM second-source (~30% share). NVIDIA qualification delays on HBM3E remain a tracked watch-point. AMD MI300 / Intel Gaudi confirmed customer mix.
L3
SK Hynix
HBM market leader (~50% share). HBM3E volume production lead; HBM4 sample shipments. Primary supplier into NVIDIA H100/H200/B200 + B100 platforms.
L3
TSMC
CoWoS advanced packaging — the constrained step for AI accelerator + HBM integration. CoWoS-S / -L / -R / SoIC capacity expansion is the most-tracked supply-side number in 2026 AI infrastructure.