Leaderboards / L3 HBM & Packaging / #2
Samsung Electronics
Active product HBM3E DRAM Stack·HBM second-source (~30% share). NVIDIA qualification delays on HBM3E remain a tracked watch-point. AMD MI300 / Intel Gaudi confirmed customer mix.
Rank in layer
#2
Confirmed customers
NVIDIA
Recent engine activity · 90 day window
Customer wins
0
Partnerships
2
Capital events
2
Hiring (60d)
0
Partnerships & acquisitions
2 signals in window
Partnerpartnership
2026-06-17Samsung participated in Zadar Labs' (Physical AI/Imaging Radars) $17 million Series A round.
↗ semiconductor.samsung.comPartnerpartnership
2026-06-17Samsung participated in Zadar Labs' $17 million Series A funding round for Imaging Radars for Physical AI.
↗ semiconductor.samsung.com
Capital events
Funding, earnings filings, and IPO-related signals
funding
2026-06-17Samsung participated in Zadar Labs' $17 million Series A round for Imaging Radars.
↗ semiconductor.samsung.comfunding
2026-06-17Samsung participated in Zadar Labs' $17 million Series A round for Physical AI imaging radar technology.
↗ semiconductor.samsung.com
Active in
Products this company is committing to per engine analysis
- CXL Memory Expansion Module/cxl-memory-fabric
- HBM3E 12-High Stack/hbm-memory
- HBM4 Stack/hbm-memory
- HBM4 Logic Base Die on Advanced Node (3nm/4nm)/hbm-memory
- HBM-Integrated AI Inference Memory Architecture (LPDDR5X + HBM Hybrid)/hbm-memory
- HBM3E 12-high 36GB Stack/hbm-memory
- HBM4 12-high 36GB Stack/hbm-memory
- HBM logic base die (3nm / 4nm foundry-fabricated)/hbm-memory
Notes
Active in: HBM3E DRAM Stack, HBM4 DRAM Stack, HBM Known-Good-Stack (KGSD) Wafer & Stack Test
Leaderboard updated 2026-06-26 · Methodology