L3 · HBM & Packaging
HBM & Packaging — Companies & Commitments
The memory-bandwidth and advanced-packaging bottleneck of every training cluster. Companies are grouped by what they build, each with the latest verified signal from the engine. Methodology →
HBM & DRAM
3| Company | Commitment | Latest signal |
|---|---|---|
| Micron TechnologyMU | HBM3E & DRAM | Micron HBM3E is sold out through 2025-2026 per company disclosures. |
| Samsung Electronics005930.KS | HBM & DRAM | Samsung announced HBM4 12-high 36GB sample shipments on March 19, 2026 with per-stack bandwidth exceeding 2 TB/s and a 4nm Samsung Foundry logic base die. |
| SK Hynix000660.KS | HBM3E / HBM4 | — |
Advanced Packaging & Foundry
3| Company | Commitment | Latest signal |
|---|---|---|
| Amkor TechnologyAMKR | OSAT packaging & test | Amkor reported Q2 2025 net sales of ~$1.50B with diluted EPS of $0.17. |
| ASE TechnologyASX | OSAT advanced packaging | ASE raised its 2026 LEAP advanced packaging revenue outlook by approximately 10% to more than US$3.5 billion, driven by AI customer demand. |
| TSMCTSM | CoWoS advanced packaging & foundry | TSMC reported approximately 30% revenue growth driven by AI chip demand surge as of June 2026. |
Other companies in this layer
7How this page is built
The roster is sourced from the engine's canonical company registry (primary_layer = L3, V15.1 taxonomy) and grouped by product sub-segment. The “latest signal” is the most relevant verified fact for each company from the layer's topics — sourced, English, and machine-verified. This is a landscape of who builds what, not a subjective ranking. For the full roster and an activity index, see /indices.
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