Stack L2
Micron Technology
HBM3E shipping in volume to NVIDIA GB300; HBM4 12-Hi samples out, targeting ~20-25% share
HQ US
Fit Score
avg of 4 segmentsRecent Business Signals
Strategic Position
What they do best
Converting US-sited DRAM + advanced-packaging capacity into qualified HBM3E supply for NVIDIA's flagship platform (signal f2a8cb6d), at scale measured in $8B+ annualized run rate (signal cd13dd7e).
Their bet
That HBM4 12-Hi samples (signal 824b304a) plus the Manassas $2B expansion (signal 8dcba94e) let Micron close the gap to SK Hynix on the 2026 HBM4 ramp rather than remain a third-source hedge.
Top risk
HBM4 customer qualification at NVIDIA slips past Q4 2026, letting SK Hynix lock multi-year HBM4 sockets while Samsung re-enters — capping Micron below the targeted 20-25% share.
Compared to peers
Direct competitor
SK Hynix
SK Hynix holds ~50% HBM share and is NVIDIA's lead HBM3E/HBM4 supplier; Micron is the ~20% follower closing the gap one platform qual at a time.
Substitute
Samsung Electronics
Samsung is the other ~30% second-source with stalled NVIDIA HBM3E qual; Micron has already cleared that bar and is shipping GB300 in volume.
Why someone would join
- 1.HBM revenue grew ~50% QoQ in FQ3 2025 and hit an $8B+ annualized run rate by FQ4 — joining HBM product/packaging roles now means scaling a business doubling inside a year, not pitching one.
- 2.Five of five recent reqs (Apr 2026 senior DRAM designer, Feb 2026 principal TSV/packaging, Mar 2026 HBM product marketing director) are HBM-coded — the org chart is being rebuilt around the NVIDIA GB300 win and HBM4 2026 ramp.
Recent Hiring (60 days)
- HBM design1
- DRAM circuit design1
- HBM applications1
- signal integrity1
- HBM product marketing1