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Micron Technology
HBM3E shipping in volume to NVIDIA GB300; HBM4 12-Hi samples out, targeting ~20-25% share
HQ US
Recent Business Signals
Jun 25, 2026
earnings
Micron Technology (MU) filed SEC Form 10-Q on 2026-06-25 (period 2026-05-28).
source: sec_edgar
Jun 24, 2026
news_mention
Micron Technology (MU) filed SEC Form 8-K on 2026-06-24 (period 2026-06-24); items 2.02,9.01.
source: sec_edgar
Jun 22, 2026
partnership
Micron and Anthropic announced a multi-year strategic agreement covering memory and storage architecture design, a multi-year supply deal, and enterprise AI adoption, with Micron making a strategic investment in Anthropic's Series H funding…
source: funding-research
Jun 22, 2026
partnership
Micron signed a strategic agreement with Anthropic covering memory/storage architecture design, a multi-year supply contract, enterprise adoption of Claude, and Micron's investment in Anthropic's Series H round.
source: funding-research
Jun 10, 2026
partnership
Micron selected Bechtel as the construction partner for its Central New York semiconductor fabrication project, part of the $100 billion fab initiative.
source: funding-research
Jun 10, 2026
partnership
Micron selected Bechtel as the construction partner for its New York semiconductor fabrication project.
source: funding-research
Jun 9, 2026
news_mention
Micron Technology (MU) filed SEC Form 8-K on 2026-06-09 (period 2026-06-09); items 5.02,9.01.
source: sec_edgar
Jun 9, 2026
leadership_change
Micron Technology, Inc. appointed Alexis Black Björlin as a new independent member of its Board of Directors, effective June 9, 2026.
source: sec_edgar
Funding & valuation history
Jun 1, 2024 · funding-research
Micron Technology received a $6.1 billion CHIPS Act grant to fund new memory fabrication plants in Idaho and New York.
Strategic Position
What they do best
Converting US-sited DRAM + advanced-packaging capacity into qualified HBM3E supply for NVIDIA's flagship platform (signal f2a8cb6d), at scale measured in $8B+ annualized run rate (signal cd13dd7e).
Their bet
That HBM4 12-Hi samples (signal 824b304a) plus the Manassas $2B expansion (signal 8dcba94e) let Micron close the gap to SK Hynix on the 2026 HBM4 ramp rather than remain a third-source hedge.
Top risk
HBM4 customer qualification at NVIDIA slips past Q4 2026, letting SK Hynix lock multi-year HBM4 sockets while Samsung re-enters — capping Micron below the targeted 20-25% share.
Compared to peers
Direct competitor
SK Hynix
SK Hynix holds ~50% HBM share and is NVIDIA's lead HBM3E/HBM4 supplier; Micron is the ~20% follower closing the gap one platform qual at a time.
Substitute
Samsung Electronics
Samsung is the other ~30% second-source with stalled NVIDIA HBM3E qual; Micron has already cleared that bar and is shipping GB300 in volume.
Why someone would join
- 1.HBM revenue grew ~50% QoQ in FQ3 2025 and hit an $8B+ annualized run rate by FQ4 — joining HBM product/packaging roles now means scaling a business doubling inside a year, not pitching one.
- 2.Five of five recent reqs (Apr 2026 senior DRAM designer, Feb 2026 principal TSV/packaging, Mar 2026 HBM product marketing director) are HBM-coded — the org chart is being rebuilt around the NVIDIA GB300 win and HBM4 2026 ramp.
Recent Hiring (60 days)
No specialty signals in the last 60 days.