{"company":{"slug":"micron-technology","name":"Micron Technology","legal_name":"Micron Technology, Inc.","aliases":["Micron","MU"],"primary_layer":"L2","primary_topic_id":"hbm-memory","secondary_topics":null,"hq_country":"US","hq_city":"Boise","founded_year":1978,"is_public":true,"ticker":"MU","description":"HBM third entrant (~20% share). US-strategic supplier; CHIPS Act direct beneficiary. HBM3E 12-Hi stack the current product anchor; HBM4 roadmap announced for 2026."},"profile":{"snapshot":"HBM3E shipping in volume to NVIDIA GB300; HBM4 12-Hi samples out, targeting ~20-25% share","stack_layer":"L2","why_join_top_2":["HBM revenue grew ~50% QoQ in FQ3 2025 and hit an $8B+ annualized run rate by FQ4 — joining HBM product/packaging roles now means scaling a business doubling inside a year, not pitching one.","Five of five recent reqs (Apr 2026 senior DRAM designer, Feb 2026 principal TSV/packaging, Mar 2026 HBM product marketing director) are HBM-coded — the org chart is being rebuilt around the NVIDIA GB300 win and HBM4 2026 ramp."],"peer_comparison":{"substitute":{"name":"Samsung Electronics","delta":"Samsung is the other ~30% second-source with stalled NVIDIA HBM3E qual; Micron has already cleared that bar and is shipping GB300 in volume."},"direct_competitor":{"name":"SK Hynix","delta":"SK Hynix holds ~50% HBM share and is NVIDIA's lead HBM3E/HBM4 supplier; Micron is the ~20% follower closing the gap one platform qual at a time."}},"self_quality_score":{"notes":"Top risk is falsifiable on NVIDIA HBM4 qualification timing; why-join cites specific reqs and dates.","originality":7,"evidence_density":9,"anti_generic_pass":true,"reverse_hype_present":true},"strategic_position":{"top_risk":"HBM4 customer qualification at NVIDIA slips past Q4 2026, letting SK Hynix lock multi-year HBM4 sockets while Samsung re-enters — capping Micron below the targeted 20-25% share.","their_bet":"That HBM4 12-Hi samples (signal 824b304a) plus the Manassas $2B expansion (signal 8dcba94e) let Micron close the gap to SK Hynix on the 2026 HBM4 ramp rather than remain a third-source hedge.","what_they_do_best":"Converting US-sited DRAM + advanced-packaging capacity into qualified HBM3E supply for NVIDIA's flagship platform (signal f2a8cb6d), at scale measured in $8B+ annualized run rate (signal cd13dd7e)."},"top_business_signals_90d":[{"summary":"HBM3E 12-high 36GB qualified and shipping in volume to NVIDIA's Blackwell Ultra (GB300), pulling Micron's HBM share toward its overall DRAM share.","signal_id":"f2a8cb6d-91fc-4ce3-ac00-12f35bbe8110","evidence_quote":"HBM3E 12-high 36GB is qualified and shipping in volume to NVIDIA for the Blackwell Ultra (GB300) platform"},{"summary":"FQ4 2025 hit record $11.3B revenue with data center doubling YoY and HBM annualized run rate above $8B.","signal_id":"cd13dd7e-24a0-409e-b69d-747ce0a3e312","evidence_quote":"record FQ4 2025 revenue of $11.3 billion... HBM annualized revenue run rate exceeding $8 billion"},{"summary":"Shipped HBM4 36GB 12-high samples delivering >2.0 TB/s per stack, 60%+ over HBM3E, to anchor 2026 AI platforms.","signal_id":"824b304a-a35a-446b-837d-ee2d2fde1b20","evidence_quote":"HBM4 36GB 12-high samples to key customers, delivering over 2.0 TB/s of bandwidth per stack — more than 60% greater than HBM3E"}],"top_hiring_specialties_60d":[{"job_count":2,"specialty":"HBM design / product engineering"},{"job_count":1,"specialty":"TSV integration & advanced packaging"},{"job_count":1,"specialty":"HBM applications & signal integrity"}]},"avg_fit_score":78.91517857142858,"fit_scores":[{"overall_score":80.375,"growth_score":88,"comp_score":null,"learning_score":78,"stability_score":72,"culture_score":68,"jobseeker_profile_id":"ded72cee-e703-40cb-a77a-836ca5c2d8e4"},{"overall_score":79,"growth_score":88,"comp_score":null,"learning_score":78,"stability_score":72,"culture_score":70,"jobseeker_profile_id":"8647db04-694f-4c25-8113-29fc019f6ca5"},{"overall_score":78.2857142857143,"growth_score":85,"comp_score":null,"learning_score":78,"stability_score":68,"culture_score":70,"jobseeker_profile_id":"32aa2776-0622-419f-87a8-f093e023eff9"},{"overall_score":78,"growth_score":88,"comp_score":null,"learning_score":78,"stability_score":72,"culture_score":68,"jobseeker_profile_id":"e93fe088-d9ce-4962-aabd-6e3214438e54"}],"recent_business_signals":[{"signal_type":"earnings","signal_date":"2025-09-23","signal_data":{"quarter":"FQ4 2025","revenue_usd":11300000000,"data_center_revenue_yoy_pct":100,"hbm_revenue_run_rate_annualized_usd":8000000000},"source":"ai_synthesis_sdk"},{"signal_type":"customer_win","signal_date":"2025-09-23","signal_data":{"product":"HBM3E 12-high 36GB","customer":"NVIDIA","platform":"Blackwell Ultra (GB300)","qualification_status":"qualified and shipping in volume"},"source":"ai_synthesis_sdk"},{"signal_type":"earnings","signal_date":"2025-06-25","signal_data":{"quarter":"FQ3 2025","revenue_usd":9300000000,"eps_non_gaap":1.91,"hbm_revenue_growth_qoq_pct":50},"source":"ai_synthesis_sdk"},{"signal_type":"leadership_change","signal_date":"2025-06-25","signal_data":{"name":"Mark Murphy","role":"EVP & Chief Financial Officer","action":"appointed","predecessor":"Mark Liu (interim)"},"source":"ai_synthesis_sdk"},{"signal_type":"capacity_expansion","signal_date":"2025-06-12","signal_data":{"focus":"mature-node memory; supports HBM ecosystem","location":"Manassas, Virginia","jobs_created":400,"investment_usd":2000000000},"source":"ai_synthesis_sdk"},{"signal_type":"product_launch","signal_date":"2025-06-10","signal_data":{"key_specs":{"capacity_gb":36,"stack_height":"12-high","pin_speed_gbps":">2.0","bandwidth_gbps_per_stack":2000},"product_name":"HBM4 12-high 36GB sample"},"source":"ai_synthesis_sdk"}],"recent_talent_signals":[{"job_title":"HBM Customer Applications Engineer","job_level":"mid","job_specialty":["HBM applications","signal integrity"],"posted_date":"2026-05-04"},{"job_title":"Senior HBM DRAM Design Engineer","job_level":"senior","job_specialty":["HBM design","DRAM circuit design"],"posted_date":"2026-04-22"},{"job_title":"Director, HBM Product Marketing","job_level":"director","job_specialty":["HBM product marketing","AI memory strategy"],"posted_date":"2026-03-25"},{"job_title":"Staff Engineer, HBM Product Engineering","job_level":"staff","job_specialty":["HBM product engineering","memory characterization"],"posted_date":"2026-03-09"},{"job_title":"Principal Engineer, HBM Packaging and TSV Integration","job_level":"principal","job_specialty":["TSV integration","advanced packaging","HBM stacking"],"posted_date":"2026-02-27"}],"citation_url":"/companies/micron-technology","last_updated":"2026-05-14T14:33:37.941141+00:00","generated_at":"2026-05-19T12:00:10.957Z"}