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Leaderboards / L3 HBM & Packaging / #6

ASE Technology

Active product CoWoS-L 2.5D Advanced Packaging (HBM Interposer)·Worlds largest OSAT (outsourced semiconductor assembly + test). FOCoS-Bridge packaging is the merchant alternative to TSMC CoWoS — capacity ramp watched for cost-of-AI relief.

Rank in layer

#6

Confirmed customers

–

Recent engine activity · 90 day window

Customer wins

0

Partnerships

2

Capital events

1

Hiring (60d)

19

Partnerships & acquisitions

2 signals in window

  • Partnerpartnership

    2026-06-01

    Alphabet's Google was approved to invest NT$27.08 billion (US$859.98 million) in Taiwan, with plans to infuse NT$25.34 billion into Charter Investments Ltd via its Singapore subsidiary.

    ↗ taipeitimes.com

  • Partnerpartnership

    2026-06-01

    ASE increased its 2026 capital expenditure to a record US$7 billion, up 27% from 2024's US$5.5 billion, to meet demand for AI applications.

    ↗ taipeitimes.com

Capital events

Funding, earnings filings, and IPO-related signals

  • funding

    2026-06-01

    ASE increased its 2026 annual capital expenditure to a record US$7 billion to meet AI application demand, up 27% from 2025's US$5.5 billion.

    ↗ taipeitimes.com

Product launches

2 launches in window

  • ASE guided 2026 LEAP (Lead-in-Early-Advanced-Packaging) revenue to exceed US$3.5 billion, up 10% from prior outlook, driven by AI chip demand.

    2026-06-01

    funding-research

    ↗ taipeitimes.com

  • ASE raised its 2026 LEAP advanced packaging revenue outlook by approximately 10% to more than US$3.5 billion, driven by AI chip demand.

    2026-06-01

    funding-research

    ↗ taipeitimes.com

Hiring focus

19 roles posted in last 60 days

other

19 active postings

Active in

Products this company is committing to per engine analysis

Notes

Active in: CoWoS-L 2.5D Advanced Packaging (HBM Interposer), HBM Known-Good-Stack (KGSD) Wafer & Stack Test

Leaderboard updated 2026-06-26 · Methodology