Leaderboards / L3 HBM & Packaging / #6
ASE Technology
Active product CoWoS-L 2.5D Advanced Packaging (HBM Interposer)·Worlds largest OSAT (outsourced semiconductor assembly + test). FOCoS-Bridge packaging is the merchant alternative to TSMC CoWoS — capacity ramp watched for cost-of-AI relief.
Rank in layer
#6
Confirmed customers
–
Recent engine activity · 90 day window
Customer wins
0
Partnerships
0
Capital events
0
Hiring (60d)
0
Active in
Products this company is committing to per engine analysis
- CoWoS-L 2.5D Advanced Packaging (HBM Interposer)/hbm-memory
- LEAP Advanced Packaging (AI Chip Packaging)/hbm-memory
- LEAP advanced packaging (fan-out / SiP)/advanced-packaging
- CoWoS-L 2.5D Advanced Packaging (HBM interposer + base die)/hbm-memory
Notes
Active in: CoWoS-L 2.5D Advanced Packaging (HBM Interposer), HBM Known-Good-Stack (KGSD) Wafer & Stack Test
Leaderboard updated 2026-06-26 · Methodology