Leaderboards / L3 HBM & Packaging / #1
Amkor Technology
Active product HBM3E DRAM Stack·US-based OSAT. Arizona advanced-packaging facility under CHIPS Act funding; positioned for US-sourced HBM + chiplet packaging — geopolitical hedge against TSMC concentration.
Rank in layer
#1
Confirmed customers
–
Recent engine activity · 90 day window
Customer wins
0
Partnerships
0
Capital events
0
Hiring (60d)
16
Hiring focus
16 roles posted in last 60 days
other
16 active postings
Active in
Products this company is committing to per engine analysis
- CoWoS (Chip-on-Wafer-on-Substrate) Advanced Packaging/advanced-packaging
- Advanced Packaging for AI Accelerators (Multi-die / Chiplet Integration)/advanced-packaging
- LEAP Advanced Packaging (AI Chip Packaging)/hbm-memory
- CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging/advanced-packaging
- Chiplet 3D stacking (Foveros / EIMB / SoIC)/advanced-packaging
- CoWoS-L 2.5D Advanced Packaging (HBM interposer + base die)/hbm-memory
Notes
Active in: HBM3E DRAM Stack, CoWoS-L 2.5D Advanced Packaging (HBM Interposer), HBM Known-Good-Stack (KGSD) Wafer & Stack Test
Leaderboard updated 2026-06-26 · Methodology