Leaderboards / L2 Silicon & Memory / #7
Samsung Electronics
Active product HBM3E / HBM4 stacked memory·HBM second-source (~30% share). NVIDIA qualification delays on HBM3E remain a tracked watch-point. AMD MI300 / Intel Gaudi confirmed customer mix.
Rank in layer
#7
Confirmed customers
NVIDIA
Recent engine activity · 90 day window
Customer wins
1
Partnerships
0
Capital events
0
Hiring (60d)
2
Customer wins
1 signal in window
NVIDIA
2026-04-10Samsung Electronics achieved HBM3E qualification for NVIDIA (Q4 2025) after multi-quarter delay, beginning volume shipments into NVIDIA platforms.
↗ news.samsung.com
Product launches
1 launch in window
Launch
2026-03-19ai_synthesis_sdk
Hiring focus
2 roles posted in last 60 days
engineering
2 active postings
Active in
Products this company is committing to per engine analysis
- HBM3E / HBM4 stacked memoryL2
- HBM3E Stack/hbm-memory
- HBM4 Stack (12-high 36GB, 2048-bit, >1.6 TB/s per stack)/hbm-memory
- HBM Known-Good-Stack (KGS/KGSD) Test Programs/hbm-memory
- HBM4 12-high stacked DRAML2
- HBM Known-Good-Stack (KGS) testL2
- HBM4 Stack/hbm-memory
- HBM4 StackL2
- HBM3E StackL2
- HBM4/hbm-memory
- HBM3E/hbm-memory
Share provenance
- site-estimate — /leaderboards/L2/samsung-electronicsas of 2026-06-08
Notes
Layer L2 product mentions: HBM3E / HBM4 stacked memory.
Leaderboard updated 2026-06-08 · Methodology