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Leaderboards / L2 Silicon & Memory / #9

Rebellions

Active product Chiplet die-to-die interconnect (UCIe / 2.5D-3D chiplet partitioning)·Korean AI inference chip startup. Atom chip + REBEL roadmap. Merged with Sapeon (SK Telecom AI chip subsidiary) in 2024. Sovereign-Korea-AI angle on inference silicon.

Rank in layer

#9

Confirmed customers

–

Recent engine activity · 90 day window

Customer wins

0

Partnerships

0

Capital events

0

Hiring (60d)

2

Hiring focus

2 roles posted in last 60 days

product

1 active posting

engineering

1 active posting

Active in

Products this company is committing to per engine analysis

  • Chiplet die-to-die interconnect (UCIe / 2.5D-3D chiplet partitioning)L2
  • Rebellions datacenter inference accelerator (Korean AI ASIC)L2
  • Datacenter LLM Inference Accelerator ASIC (LPU / RDU / Blackhole-class)/ai-asics
  • Chiplet AI Accelerator with 2.5D/3D Advanced Packaging/ai-asics
  • Non-NVIDIA AI accelerator ASIC (LPU / RDU / wafer-scale / Instinct class)L2
  • Chiplet die-to-die interconnect (UCIe-based)L2
  • 2.5D/3D Chiplet Advanced Packaging with UCIe + HBM/ai-asics
  • Rebellions Datacenter Inference ASIC (scale-out chiplet)/ai-asics
  • Custom AI Inference ASICL2
  • Chiplet / UCIe Die-to-Die InterconnectL2
  • Rebellions Scale-Out Datacenter LLM Inference Accelerator (chiplet)/ai-asics
  • Chiplet / Advanced Packaging stack for AI accelerators (2.5D/3D + UCIe + HBM)/ai-asics

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Notes

Layer L2 product mentions: Chiplet die-to-die interconnect (UCIe / 2.5D-3D chiplet partitioning), Rebellions datacenter inference accelerator (Korean AI ASIC).

Leaderboard updated 2026-06-08 · Methodology