Leaderboards / L2 Silicon & Memory / #1
Amkor Technology
Active product HBM3E / HBM4 stacked memory·US-based OSAT. Arizona advanced-packaging facility under CHIPS Act funding; positioned for US-sourced HBM + chiplet packaging — geopolitical hedge against TSMC concentration.
Rank in layer
#1
Confirmed customers
–
Recent engine activity · 90 day window
Customer wins
0
Partnerships
0
Capital events
0
Hiring (60d)
2
Hiring focus
2 roles posted in last 60 days
engineering
2 active postings
Active in
Products this company is committing to per engine analysis
- HBM3E / HBM4 stacked memoryL2
- CoWoS 2.5D advanced packaging (HBM-on-logic)L2
- CoWoS 2.5D Advanced Package for HBM-on-Logic/hbm-memory
- HBM Known-Good-Stack (KGS/KGSD) Test Programs/hbm-memory
- HBM Known-Good-Stack (KGS) testL2
- CoWoS-L 2.5D advanced packagingL2
- CoWoS 2.5D Advanced Packaging for HBM Integration/hbm-memory
- HBM Known-Good-Stack (KGS/KGSD) Test/hbm-memory
- CoWoS-L 2.5D Advanced PackagingL2
- CoWoS HBM Advanced Packaging (2.5D)/hbm-memory
- HBM Known-Good-Stack (KGS) Test/hbm-memory
Share provenance
- site-estimate — /leaderboards/L2/amkor-technologyas of 2026-06-08
Notes
Layer L2 product mentions: HBM3E / HBM4 stacked memory, CoWoS 2.5D advanced packaging (HBM-on-logic).
Leaderboard updated 2026-06-08 · Methodology