{"slug":"cxl-memory-fabric","title":"CXL Memory Fabric","tagline":"Compute Express Link: memory pooling, expansion, and the disaggregation bet for AI inference.","hub_url":"/topic/cxl-memory-fabric","counts":{"companies":5,"business_signals_90d":0,"talent_signals":0},"companies":[{"slug":"marvell-technology","name":"Marvell Technology, Inc.","primary_layer":"L4","description":"Custom compute and connectivity silicon — designs hyperscaler AI ASICs (e.g. AWS Trainium) plus optical DSPs and SerDes.","profile_url":"/companies/marvell-technology"},{"slug":"astera-labs","name":"Astera Labs","primary_layer":"L2","description":"Connectivity silicon for AI infrastructure — PCIe/CXL retimers and smart cable modules for GPU scale-up fabrics.","profile_url":"/companies/astera-labs"},{"slug":"micron-technology","name":"Micron Technology","primary_layer":"L3","description":"HBM third entrant (~20% share). US-strategic supplier; CHIPS Act direct beneficiary. HBM3E 12-Hi stack the current product anchor; HBM4 roadmap announced for 2026.","profile_url":"/companies/micron-technology"},{"slug":"samsung-electronics","name":"Samsung Electronics","primary_layer":"L3","description":"HBM second-source (~30% share). NVIDIA qualification delays on HBM3E remain a tracked watch-point. AMD MI300 / Intel Gaudi confirmed customer mix.","profile_url":"/companies/samsung-electronics"},{"slug":"alphawave-semi","name":"Alphawave Semi","primary_layer":"L4","description":"High-speed connectivity IP — SerDes, chiplets, and custom silicon for AI / datacenter interconnect.","profile_url":"/companies/alphawave-semi"}],"generated_at":"2026-06-14T03:15:56.807Z"}