{"slug":"advanced-packaging","title":"Advanced Packaging (CoWoS & SoIC)","tagline":"CoWoS, SoIC, and the 2.5D/3D packaging bottleneck that gates every HBM-equipped AI accelerator.","hub_url":"/topic/advanced-packaging","counts":{"companies":10,"business_signals_90d":91,"talent_signals":75,"jobseeker_profiles":0,"fit_scores":0},"companies":[{"slug":"amkor-technology","name":"Amkor Technology","primary_layer":"L3","description":"US-based OSAT. Arizona advanced-packaging facility under CHIPS Act funding; positioned for US-sourced HBM + chiplet packaging — geopolitical hedge against TSMC concentration.","profile_url":"/companies/amkor-technology"},{"slug":"sk-hynix","name":"SK Hynix","primary_layer":"L3","description":"HBM market leader (~50% share). HBM3E volume production lead; HBM4 sample shipments. Primary supplier into NVIDIA H100/H200/B200 + B100 platforms.","profile_url":"/companies/sk-hynix"},{"slug":"samsung-electronics","name":"Samsung Electronics","primary_layer":"L3","description":"HBM second-source (~30% share). NVIDIA qualification delays on HBM3E remain a tracked watch-point. AMD MI300 / Intel Gaudi confirmed customer mix.","profile_url":"/companies/samsung-electronics"},{"slug":"ase-technology","name":"ASE Technology","primary_layer":"L3","description":"Worlds largest OSAT (outsourced semiconductor assembly + test). FOCoS-Bridge packaging is the merchant alternative to TSMC CoWoS — capacity ramp watched for cost-of-AI relief.","profile_url":"/companies/ase-technology"},{"slug":"jcet","name":"JCET","primary_layer":"L3","description":"Top global OSAT specializing in advanced packaging for high-performance modules and AI chips.","profile_url":"/companies/jcet"},{"slug":"deca-technologies","name":"Deca Technologies","primary_layer":"L3","description":"Technology specialist in fan-out wafer-level packaging (FOWLP) building US-based open innovation platforms for AI and HPC.","profile_url":"/companies/deca-technologies"},{"slug":"absolics","name":"Absolics","primary_layer":"L3","description":"Supplier of glass substrates for advanced packaging that boost routing density and reliability of leading-edge AI chips.","profile_url":"/companies/absolics"},{"slug":"ase-group","name":"ASE Group","primary_layer":"L3","description":"Leading pure-play OSAT with critical 2.5D/3D packaging capabilities for AI accelerators, GPUs, and FPGAs.","profile_url":"/companies/ase-group"},{"slug":"spil-siliconware-precision","name":"SPIL (Siliconware Precision)","primary_layer":"L3","description":"Established OSAT that opened a new AI-focused advanced packaging plant in Taichung in 2025.","profile_url":"/companies/spil-siliconware-precision"},{"slug":"tsmc","name":"TSMC","primary_layer":"L3","description":"CoWoS advanced packaging — the constrained step for AI accelerator + HBM integration. CoWoS-S / -L / -R / SoIC capacity expansion is the most-tracked supply-side number in 2026 AI infrastructure.","profile_url":"/companies/tsmc"}],"generated_at":"2026-07-28T20:10:40.899Z","personas":[]}