{"company":{"slug":"deca-technologies","name":"Deca Technologies","legal_name":null,"aliases":null,"primary_layer":"L3","primary_topic_id":"advanced-packaging","secondary_topics":null,"hq_country":null,"hq_city":null,"founded_year":2009,"is_public":false,"ticker":"","description":"Technology specialist in fan-out wafer-level packaging (FOWLP) building US-based open innovation platforms for AI and HPC."},"profile":null,"recent_business_signals":[],"recent_talent_signals":[],"citation_url":"/companies/deca-technologies","last_updated":"2026-06-23T13:11:23.049+00:00","generated_at":"2026-06-23T16:01:41.944Z","avg_fit_score":null,"fit_scores":[]}